This position is especially suited for top-tier talent from semiconductor, HPC server/system or AI cloud platform companies with strong experience in advanced packaging, mechanical design, mechanical stress simulation, and manufacturing execution who want to remain technically involved while also helping guide technology strategy, edged-chip cooling technology, engineering excellence, and future team growth.
Key Responsibilities
Perform and lead thermal-mechanical architecture and solution strategy for advanced semiconductor packaging solutions from SoC to system.
Perform and drive thermal-mechanical design, thermo-mechanical analysis, and integrated solution development from concept through production.
Perform and guide stress, warpage, reliability, and package-board interaction modeling using FEA tools.
Partner with silicon, packaging, thermal, reliability, manufacturing, and supplier teams to optimize product performance and manufacturability.
Drive Design for Manufacturability, Design for Assembly, tolerance analysis, FMEA, DVP&R, ECO governance, BOM cost review, and supplier management.
Conduct and lead qualification, failure analysis, and root-cause investigations across NPI and production.
Establish and control package mechanical specifications, design guidelines, product CAD models, simulation reports, assembly instructions, qualification documentation, and technical reports.
Preferred Experience
Hands-on expertise with Creo, SolidWorks, ANSYS Mechanical, and assembly tolerance analysis
Profound mechanical design skills of the package, PCB, system-level robust solution with the high-power chip cooling integration.
Proven track record in architecting and delivering advanced cooling solutions, including heatsinks, vapor chambers, heat pipes, and liquid cold plates, from concept and feasibility through DFM, prototyping, qualification, and high-volume manufacturing (HVM).
Demonstrated experience with cooling solution manufacturing processes and technologies, including machining, brazing, soldering, skiving, extrusion, vapor chamber fabrication, cold plate manufacturing, assembly, process qualification, yield improvement, and supplier ramp to volume production.
Proven technical leadership in complex semiconductor product development environments.
Deep knowledge of thermo-mechanical reliability, stress analysis, warpage, and package-board interaction, including correlating simulations with DIC, shadow moiré, warpage metrology, strain gauges, thermal cycling data, cross-section analysis, acoustic microscopy, and failure analysis results.
Experience working with OSATs, foundries, substrate suppliers, and high-volume cooling solution manufacturing partners.
ACADEMIC CREDENTIALS
MS or PhD in Mechanical Engineering, Materials Engineering, Electrical Engineering, Applied Mechanics, or a related technical field. Bachelor’s and equivalent industry experience may be considered.
This role is not eligible for visa sponsorship.
#LI-DR2
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
THE ROLE
Join AMD's advanced packaging organization and help shape the mechanical architecture of next-generation high-performance computing, AI, and semiconductor products. As a Principal Mechanical Engineer, you will lead the development of advanced package-board-system mechanical solutions spanning concept definition, mechanical design, simulation, qualification, and manufacturing ramp. This is a highly visible technical leadership role that offers the opportunities to influence product direction, solve complex product challenges from package, server and rack system. Daily work across core-development team from marketing, system architecture, HW & SW, reliability, and manufacturing to bring industry-leading technologies to market.
THE PERSON
The ideal candidate brings the technical depth of a principal-level individual contributor, the judgment as a senior engineering leader, and the hands-on capability to personally drive product solution design, team reviews, supplier engagement, and problem resolution from concept through NPI, qualification, and production ramp. You enjoy solving complex problems, hand-on skills of advanced CAD design and thermal-mechanical FEA modelling tools, mentoring engineers, and driving execution across cross-functional teams.
This position is especially suited for top-tier talent from semiconductor, HPC server/system or AI cloud platform companies with strong experience in advanced packaging, mechanical design, mechanical stress simulation, and manufacturing execution who want to remain technically involved while also helping guide technology strategy, edged-chip cooling technology, engineering excellence, and future team growth.
Key Responsibilities
Perform and lead thermal-mechanical architecture and solution strategy for advanced semiconductor packaging solutions from SoC to system.
Perform and drive thermal-mechanical design, thermo-mechanical analysis, and integrated solution development from concept through production.
Perform and guide stress, warpage, reliability, and package-board interaction modeling using FEA tools.
Partner with silicon, packaging, thermal, reliability, manufacturing, and supplier teams to optimize product performance and manufacturability.
Drive Design for Manufacturability, Design for Assembly, tolerance analysis, FMEA, DVP&R, ECO governance, BOM cost review, and supplier management.
Conduct and lead qualification, failure analysis, and root-cause investigations across NPI and production.
Establish and control package mechanical specifications, design guidelines, product CAD models, simulation reports, assembly instructions, qualification documentation, and technical reports.
Preferred Experience
Hands-on expertise with Creo, SolidWorks, ANSYS Mechanical, and assembly tolerance analysis
Profound mechanical design skills of the package, PCB, system-level robust solution with the high-power chip cooling integration.
Proven track record in architecting and delivering advanced cooling solutions, including heatsinks, vapor chambers, heat pipes, and liquid cold plates, from concept and feasibility through DFM, prototyping, qualification, and high-volume manufacturing (HVM).
Demonstrated experience with cooling solution manufacturing processes and technologies, including machining, brazing, soldering, skiving, extrusion, vapor chamber fabrication, cold plate manufacturing, assembly, process qualification, yield improvement, and supplier ramp to volume production.
Proven technical leadership in complex semiconductor product development environments.
Deep knowledge of thermo-mechanical reliability, stress analysis, warpage, and package-board interaction, including correlating simulations with DIC, shadow moiré, warpage metrology, strain gauges, thermal cycling data, cross-section analysis, acoustic microscopy, and failure analysis results.
Experience working with OSATs, foundries, substrate suppliers, and high-volume cooling solution manufacturing partners.
ACADEMIC CREDENTIALS
MS or PhD in Mechanical Engineering, Materials Engineering, Electrical Engineering, Applied Mechanics, or a related technical field. Bachelor’s and equivalent industry experience may be considered.
This role is not eligible for visa sponsorship.
#LI-DR2
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
