Lead technical engagement with OSAT and foundry partners: set yield targets, run joint yield reviews and drive corrective actions to owner and committed date.
Drive root cause analysis on yield issues (detection, bin analysis, inline and equipment data, failure analysis) against a ≤1-day time to first actionable insight.
Build and maintain root cause Paretos for each product and drive the top contributors to closure with partners.
Publish a weekly yield report and lead yield reviews with Business Unit, Product Engineering and partner leadership.
Define data-readiness requirements (yield data feeds, die-level traceability) with OSAT and foundry partners ahead of each product's first build.
Mentor analysts and help shape AI-assisted analytics tools used by the team.
Preferred Experience
Semiconductor packaging, assembly or test yield.
Hands-on yield ramp experience in advanced packaging: 2.5D/3D/3.5D heterogeneous integration, fan-out, silicon bridge or hybrid bonding.
Track record of driving OSAT and foundry partners to root cause and closure on yield issues.
Strong SQL and Python; comfortable working directly in large manufacturing data sets (Snowflake or similar).
Clear communicator who can brief executives and run cross-functional task forces.
Experience with partner data systems (B2B feeds, STDF (standard test data format) , die-level traceability).
Use of AI/agentic tools in engineering analysis.
Experience across multiple product segments (client, server, data center).
Education
BS/MS/PhD in EE, ME, Materials, Chemical Eng. or related field
This role is not eligible for visa sponsorship.
#LI-AP1
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
The Role
AMD products increasingly depend on advanced packaging, including 2.5D/3D/3.5D heterogeneous integration, fan-out and silicon bridge technologies, built with a global network of OSAT and foundry partners. This role owns assembly and test yield for an advanced packaging platform from NPI through high-volume manufacturing. You will be the single point of accountability for that platform's packaging yield, working across OSAT and foundry partners, Product Engineering, Package Design, the Business Units and AMD leadership.
The Person
Ideal candidate can synthesize complex topics in a short period of time. Collaboration across organizations, work with engineers and executives globally, cross functional collaboration. Self starter with strong ownership.
Responsibilities
Own packaging yield for a portfolio of advanced packaging products from NPI through ramp to high-volume manufacturing.
Lead technical engagement with OSAT and foundry partners: set yield targets, run joint yield reviews and drive corrective actions to owner and committed date.
Drive root cause analysis on yield issues (detection, bin analysis, inline and equipment data, failure analysis) against a ≤1-day time to first actionable insight.
Build and maintain root cause Paretos for each product and drive the top contributors to closure with partners.
Publish a weekly yield report and lead yield reviews with Business Unit, Product Engineering and partner leadership.
Define data-readiness requirements (yield data feeds, die-level traceability) with OSAT and foundry partners ahead of each product's first build.
Mentor analysts and help shape AI-assisted analytics tools used by the team.
Preferred Experience
Semiconductor packaging, assembly or test yield.
Hands-on yield ramp experience in advanced packaging: 2.5D/3D/3.5D heterogeneous integration, fan-out, silicon bridge or hybrid bonding.
Track record of driving OSAT and foundry partners to root cause and closure on yield issues.
Strong SQL and Python; comfortable working directly in large manufacturing data sets (Snowflake or similar).
Clear communicator who can brief executives and run cross-functional task forces.
Experience with partner data systems (B2B feeds, STDF (standard test data format) , die-level traceability).
Use of AI/agentic tools in engineering analysis.
Experience across multiple product segments (client, server, data center).
Education
BS/MS/PhD in EE, ME, Materials, Chemical Eng. or related field
This role is not eligible for visa sponsorship.
#LI-AP1
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
