PCB Domain
Own PCB material strategy for K2 cards: selection, qualification, and stackup design
Challenge PCB construction defaults with full understanding of manufacturability risk
Guide design teams on material selection for signal integrity and thermal requirements
Lead material characterization experiments; own data analysis and decision outputs
Introduce new PCB materials, balancing performance gains against qualification and supply chain risk
Mechanical & Thermal Domain
Select and qualify TIMs, adhesives, encapsulants, and underfills for Nitro card assemblies
Design vapor chamber and liquid cooling solutions for high-performance hardware
Evaluate material performance under temperature cycling, vibration, and humidity conditions
Define reliability test plans and own qualification data packages for NPI
Cross-Functional & Strategic
Develop and socialize design rules, test methodologies, and manufacturing best practices
Serve as materials engineering authority in design reviews, NPI gating, and supplier discussions
Monitor EOL notifications, evaluate alternatives, and qualify drop-in replacements
Mentor engineers, contribute to hiring, and raise the technical bar
About the team
Our Nitro Cards ("K2") are present in each and every server deployed at AWS, continuously innovating across new technologies, new server platforms, and new cloud services.
Nitro Cards serves critical roles in the server control plane and data path — delivering better performance, greater stability, and higher availability to customers at a global scale.
We work closely with the Nitro Silicon and Nitro Firmware and Software teams across definition, development, and mass production to optimize product value and accelerate time-to-market.
We learn from large-scale production health data and feed those insights back to continuously improve our products and processes.
Our success depends on world-class designs and the ability to deliver them on time, at scale, and with the best possible value for our customers — handling massive scale and the rapid integration of emerging technologies.
8+ years of direct experience in materials engineering for hardware products, encompassing PCB materials, laminate technologies, air and/or liquid cooling design aspects, and electronic assembly manufacturing processes
B.Sc. or higher in Materials Engineering, Materials Science, Chemical Engineering, Mechanical Engineering, or a closely related field
Deep expertise in PCB laminate systems: familiarity with high-speed/low-loss dielectric materials, hybrid stackup design principles, and the trade-offs between material classes used in high-performance electronic assemblies
Experience with high scale product manufacturing and working with remote vendors
Strong analytical skills: ability to design experiments (DOE), analyze data rigorously, and draw actionable conclusions
Experience with high-speed PCB materials and hybrid stackup design in data center or server hardware
Familiarity with IPC and JEDEC standards for PCB and assembly materials
Background in cloud or hyperscale hardware, with understanding of reliability, thermal, and supply continuity demands
Track record leading new material introduction (NMI) programs from selection through production release
Experience managing supply chain risk: EOL components, second-source qualification, and procurement decisions
Demonstrated organizational influence through technical standards, cross-team initiatives, or hiring contributions
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.
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